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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/8536
Title: Performance comparison of carbon nanotube, nickel silicide nanowire and copper VLSI interconnects: Perspectives and challenges ahead
Authors: Duksh Y.S.
Kumar Kaushik, Brajesh
Sarkar S.
Singh R.
Published in: Journal of Engineering, Design and Technology
Abstract: Purpose: The purpose of this paper is to explore and evaluate the performance comparison of carbon nanotubes (CNT) and nickel silicide (NiSi) nanowires interconnects as prospective alternatives to copper wire interconnects. Design/methodology/approach: The increasing resistivity of the copper wire with scaling and rising demands on current density drives the need for identifying new wiring solutions. This paper explores the various alternatives to copper. The metallic bundle CNTs and NiSi nanowires are promising candidates that can potentially address the challenges faced by copper. This paper analyzes various electrical models of carbon nanotube and recently introduced novel interconnect solution using NiSi nanowires. Findings: The theoretical studies proves CNTs and NiSi nanowires to be better alternatives against copper on the ground of performance parameters, such as effective current density, delay and power consumption. NiSi nanowire provides highest propagation speed for short wire length, and copper is the best for intermediate wire length, while bundle CNTs is faster for long wire length. NiSi nanowire has lowest power consumption than copper and CNTs. Originality/value: This paper investigates, assess and compares the performance of carbon nanotubes (CNT) and NiSi nanowires interconnects as prospective alternatives to copper wire interconnects in future VLSI chips. © Emerald Group Publishing Limited.
Citation: Journal of Engineering, Design and Technology (2010), 8(3): 334-353
URI: https://doi.org/10.1108/17260531011086199
http://repository.iitr.ac.in/handle/123456789/8536
Issue Date: 2010
Keywords: Carbon
Circuits
Copper
Nanotechnology
ISSN: 17260531
Author Scopus IDs: 36805538500
57021830600
7403239706
54913203500
Author Affiliations: Duksh, Y.S., Department of Electronics and Instrumentation Engineering, Faculty of Engineering and Technology, M. J. P. Rohilkhand University, Bareilly, India
Kaushik, B.K., Department of Electronics and Computer Engineering, Indian Institute of Technology-Roorkee, Roorkee, India
Sarkar, S., Mody Institute of Technology and Science, Sikar, India
Singh, R., School of Electronics, Shobhit University, Meerut, India
Corresponding Author: Duksh, Y. S.; Department of Electronics and Instrumentation Engineering, Faculty of Engineering and Technology, M. J. P. Rohilkhand University, Bareilly, India; email: brajesh_k_k@yahoo.com
Appears in Collections:Journal Publications [ECE]

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