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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/8397
Title: Investigating continuous class-F power amplifier using nonlinear embedding model
Authors: Aggrawal E.
Rawat, Karun
Roblin P.
Published in: IEEE Microwave and Wireless Components Letters
Abstract: This letter investigates the design space for feasible load impedances of broadband continuous class-F power amplifier (PA) using the nonlinear embedding transfer function. This can overcome the limitation of anticlockwise trajectory of secondharmonic impedance on Smith chart. The approach starts with the design at intrinsic plane based on generic representation of drain voltage and current waveforms. Nonlinear embedding transfer network is then used to project intrinsic loads to the package plane. The proposed design strategy is verified with the implementation of a 15-W GaN HEMT-based PA operating over the frequency range of 1.5 to 2.5 GHz with drain efficiency between 60%-75%. This corresponds to the fractional bandwidth of 50%. © 2017 IEEE.
Citation: IEEE Microwave and Wireless Components Letters (2017), 27(6): 593-595
URI: https://doi.org/10.1109/LMWC.2017.2701316
http://repository.iitr.ac.in/handle/123456789/8397
Issue Date: 2017
Publisher: Institute of Electrical and Electronics Engineers Inc.
Keywords: Broadband
Continuous class-F
Design space
Embedding transfer network (ETN)
GaN HEMT
ISSN: 15311309
Author Scopus IDs: 56126169500
57000644800
35482440300
Author Affiliations: Aggrawal, E., Department of Electronics and Communication Engineering, IIT Roorkee, Roorkee, 247667, India
Rawat, K., Department of Electronics and Communication Engineering, IIT Roorkee, Roorkee, 247667, India
Roblin, P., Department of Electrical and Computer Engineering, Ohio State University, Columbus, OH 43210, United States
Funding Details: This work was supported in part by the SERB Grant SB/S3/EECE/047/2014 and in part by Visvesvaraya Ph.D. scheme.
Corresponding Author: Aggrawal, E.; Department of Electronics and Communication Engineering, IIT RoorkeeIndia; email: aggrawal.ekta@gmail.com
Appears in Collections:Journal Publications [ECE]

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