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Title: FDTD technique based crosstalk analysis of bundled SWCNT interconnects
Authors: Duksh Y.S.
Kumar Kaushik, Brajesh
Agarwal R.P.
Published in: Journal of Semiconductors
Abstract: The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain (FDTD) technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE. © 2015 Chinese Institute of Electronics.
Citation: Journal of Semiconductors (2015), 36(5): -
Issue Date: 2015
Publisher: Institute of Physics Publishing
Keywords: coupled transmission lines
crosstalk delay
peak voltage
SWCNT bundle interconnects
ISSN: 16744926
Author Scopus IDs: 36805538500
Author Affiliations: Duksh, Y.S., Department of Electronics and Instrumentation Engineering, Mahatma Jyotiba Phule Rohilkhand University, Bareilly, 243006, India
Kaushik, B.K., Department of Electronics and Communication Engineering, Indian Institute of Technology, Roorkee, 247667, India
Agarwal, R.P., Shobhit University, Modipuram, Meerut, 250110, India
Corresponding Author: Duksh, Y.S.; Department of Electronics and Instrumentation Engineering, Mahatma Jyotiba Phule Rohilkhand UniversityIndia; email:
Appears in Collections:Journal Publications [ECE]

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