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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/7967
Title: A cost effective solution for development of broadband radar absorbing material using electronic waste
Authors: Panwar R.
Agarwala V.
Singh D.
Published in: Ceramics International
Abstract: Electronic-waste items like disassembled mobile and computer printed circuit boards (PCBs) have been processed in a high energy planetary ball-mill for 10 h, to investigate the dielectric, magnetic and radar absorbing properties. The main goal of present paper is to achieve wide bandwidth for <-10 dB reflection loss at minimum cost in the frequency range of 8.2 to 12.4 GHz. The frequency dependent complex permittivity and permeability values of electronic waste composite material have been measured using transmission/reflection approach, and are used for computation of reflection loss with varying absorber layer thickness ranging from 1.0 to 3.5 mm. A single layer absorber is fabricated with optimal coating thickness of 2.5 mm (i.e., thickness value for reflection loss <-10 dB). The measured reflection loss value has been found to -27.98 dB at 9.3 GHz with absorber layer thickness of 2.5 mm, which may ascribe to proper impedance matching and large dielectric loss. Moreover, broadest bandwidth (for <-10 dB reflection loss) covering the maximum frequency range of X-band has been noticed as 3.9 GHz. Results demonstrate the enormous potential of the electronic waste composite material to act as highly efficient, cost effective, and broadband radar wave absorber for various practical electromagnetic applications. © 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
Citation: Ceramics International (2015), 41(2): 2923-2930
URI: https://doi.org/10.1016/j.ceramint.2014.10.118
http://repository.iitr.ac.in/handle/123456789/7967
Issue Date: 2015
Publisher: Elsevier Ltd
Keywords: Electronic waste composite material
Printed circuit boards (PCBs)
Radar absorbing material (RAM)
Reflection loss
ISSN: 2728842
Author Scopus IDs: 56377800100
7005242439
36912015700
Author Affiliations: Panwar, R., Surface Engineering Laboratory, MMED, Roorkee, 247667, India, Microwave Imaging and Space Technology Application Laboratory, ECE Department, Roorkee, 247667, India
Agarwala, V., Surface Engineering Laboratory, MMED, Roorkee, 247667, India, Centre of Excellence Nanotechnology, Indian Institute of Technology Roorkee, Roorkee, 247667, India
Singh, D., Microwave Imaging and Space Technology Application Laboratory, ECE Department, Roorkee, 247667, India, Centre of Excellence Nanotechnology, Indian Institute of Technology Roorkee, Roorkee, 247667, India
Funding Details: The authors gratefully acknowledge the financial support from the Indo-Australia DST project and Defence Research & Development Organization (DRDO), New Delhi, India and also Institute of Mineral and Materials Technology (IMMT) Bhubaneswar, India for providing waste PCBs. The first author would also like to thank Ministry of Human Resource Development (MHRD), Government of India for providing fellowship for carrying out research work.
Corresponding Author: Singh, D.; Microwave Imaging and Space Technology Application Laboratory, ECE DepartmentIndia
Appears in Collections:Journal Publications [ECE]

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