|Title:||A new heat flux continuity model for thermal analysis of laminated plates|
Mishra, B. K.
|Published in:||Journal of Composite Materials|
|Abstract:||A new analytical model has been proposed in this paper for the accurate analysis of through-the-thickness temperature variation in composites and sandwich laminates based on piecewise linear zig-zag thermal lamination theory. This theory assumes a piecewise linear through-the-thickness temperature distribution in terms of temperature at the reference plane and temperature slopes at the layer interfaces. The continuity of temperature at different layers is ensured by choosing a suitable temperature profile. The unknown slopes at different interfaces are subsequently expressed in terms of the reference plane slopes through satisfaction of heat flux continuity conditions at the layer interfaces. The thermal conduction properties of different layers in the thickness direction are utilized for this purpose. This helps to maintain lesser number of computational unknowns and the resulting formulation for the thermal analysis can be very conveniently combined with the 2D refined layer-wise theories used for the mechanical analysis of laminated plates. Numerical examples are solved to show the accuracy of the proposed model by comparing the present results with 3D solutions. © The Author(s) 2012 Reprints and permissions: sagepub.co.uk/journalsPermissions.nav.|
|Citation:||Journal of Composite Materials(2013), 47(17): 2053-2059|
thermal lamination theory
|Author Scopus IDs:||54904097400|
|Author Affiliations:||Khandelwal, R.P., Department of Civil Engineering, Indian Institute of Technology, Roorkee, 247667, India|
Chakrabarti, A., Department of Civil Engineering, Indian Institute of Technology, Roorkee, 247667, India
Mishra, B.K., Department of Mechanical and Industrial Engineering, Indian Institute of Technology, Roorkee, India
Bhargava, P., Department of Civil Engineering, Indian Institute of Technology, Roorkee, 247667, India
|Funding Details:||Financial support obtained for the present work from the Department of Science and Technology, New Delhi, India, under the grant DST-536-CED is gratefully acknowledged.|
|Corresponding Author:||Khandelwal, R.P.; Department of Civil Engineering, Indian Institute of Technology, Roorkee, 247667, India; email: firstname.lastname@example.org|
|Appears in Collections:||Journal Publications [CE]|
Journal Publications [ME]
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