http://repository.iitr.ac.in/handle/123456789/24272
Title: | Temperature-regulating materials for advanced food packaging applications: a review |
Authors: | Singh S. Gaikwad, Kirtiraj K. Lee M. Lee Y.S. |
Published in: | Journal of Food Measurement and Characterization |
Abstract: | The use of temperature-regulating material (TRM)-based food packaging is recently trending in the food science and technology sectors. Although this technology is still not fully commercially viable, it has good potential to control the temperature of perishable and high-value agricultural products during transport. Scope and approach: Firstly, this paper describes all the aspects of TRM packaging, including their classification, various technical approaches, and commercial applications, with special focus on the direct integration of TRMs into food packaging systems. Secondly, to provide useful guidelines for future research in the field, this paper discusses some important aspects that still hinder the full exploitation of TRM technology within the food packaging industry. To make the TRM packaging systems commercially viable, future research needs to consider some important aspects including cost, consumer acceptance and confidence, regulatory aspects (e.g., labeling), and multi-functionality. © 2017, Springer Science+Business Media, LLC. |
Citation: | Journal of Food Measurement and Characterization, 12(1): 588-601 |
URI: | https://doi.org/10.1007/s11694-017-9672-5 http://repository.iitr.ac.in/handle/123456789/24272 |
Issue Date: | 2018 |
Publisher: | Springer Verlag |
Keywords: | Encapsulation Food packaging Phase transition Temperature regulating material (TRM) |
ISSN: | 21934126 |
Author Scopus IDs: | 57145063200 56954807800 57190163808 12242077800 |
Author Affiliations: | Singh, S., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea Gaikwad, K.K., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea Lee, M., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea Lee, Y.S., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea |
Corresponding Author: | Lee, Y.S.; Department of Packaging, South Korea; email: leeyouns@yonsei.ac.kr |
Appears in Collections: | Journal Publications [PT] |
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