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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/24272
Title: Temperature-regulating materials for advanced food packaging applications: a review
Authors: Singh S.
Gaikwad, Kirtiraj K.
Lee M.
Lee Y.S.
Published in: Journal of Food Measurement and Characterization
Abstract: The use of temperature-regulating material (TRM)-based food packaging is recently trending in the food science and technology sectors. Although this technology is still not fully commercially viable, it has good potential to control the temperature of perishable and high-value agricultural products during transport. Scope and approach: Firstly, this paper describes all the aspects of TRM packaging, including their classification, various technical approaches, and commercial applications, with special focus on the direct integration of TRMs into food packaging systems. Secondly, to provide useful guidelines for future research in the field, this paper discusses some important aspects that still hinder the full exploitation of TRM technology within the food packaging industry. To make the TRM packaging systems commercially viable, future research needs to consider some important aspects including cost, consumer acceptance and confidence, regulatory aspects (e.g., labeling), and multi-functionality. © 2017, Springer Science+Business Media, LLC.
Citation: Journal of Food Measurement and Characterization, 12(1): 588-601
URI: https://doi.org/10.1007/s11694-017-9672-5
http://repository.iitr.ac.in/handle/123456789/24272
Issue Date: 2018
Publisher: Springer Verlag
Keywords: Encapsulation
Food packaging
Phase transition
Temperature regulating material (TRM)
ISSN: 21934126
Author Scopus IDs: 57145063200
56954807800
57190163808
12242077800
Author Affiliations: Singh, S., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea
Gaikwad, K.K., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea
Lee, M., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea
Lee, Y.S., Department of Packaging, Yonsei University, Wonju, 220-710, South Korea
Corresponding Author: Lee, Y.S.; Department of Packaging, South Korea; email: leeyouns@yonsei.ac.kr
Appears in Collections:Journal Publications [PT]

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