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Title: Free Vibration Analysis of Sandwich Plate with Honeycomb Core and FGM Face Sheets
Authors: Singh S.J.
Harsha, Suraj Prakash
Saran V.H.
Misra R.K.
Published in: Lecture Notes in Mechanical Engineering
43rd National Systems Conference on Innovative and Emerging Trends in Engineering Systems, NSC 2019
Abstract: This paper is presented to analyze the sandwich plates with honeycomb core and FGM face sheets for free vibration responses. The equations of motions are derived using Hamilton’s principle and solved using Navier’s method for simply supported sandwich plate. The special type of honeycomb structure known as “auxetic materials” with negative Poisson’s ratio provides excellent resistance to dynamic excitations. The material property of face sheets is graded in the thickness direction using simple power law (P-FGM). Furthermore, parametric studies are performed to analyze the combined effect of span-to-thickness ratio, volume fraction exponent, aspect ratio and geometric parameters of honeycomb structure on fundamental frequency for sandwich P-FGM plates. The results for the soft homogenous core are validated with the previous studies on sandwich plate. It is observed that the fundamental frequency always increases with a decrease in modulus of angle. In addition, due to the presence of honeycomb core in a sandwich plate, unexpected change may occur with the change in geometric parameters. © 2021, Springer Nature Singapore Pte Ltd.
Citation: Lecture Notes in Mechanical Engineering (2021): 905-917
Issue Date: 2021
Publisher: Springer Science and Business Media Deutschland GmbH
Keywords: Frequency
Functionally graded materials
Navier’s method
Power law
Sandwich plate
ISBN: 9.78981E+12
ISSN: 21954356
Author Scopus IDs: 56258512400
Author Affiliations: Singh, S.J., Department of Mechanical Engineering, Pandit Deendayal Petroleum University, Gandhinagar, Gujarat, 382009, India
Harsha, S.P., Mechanical and Industrial Engineering Department, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, 247667, India
Corresponding Author: Singh, S.J.; Department of Mechanical Engineering, India; email:
Appears in Collections:Conference Publications [ME]

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