http://repository.iitr.ac.in/handle/123456789/18188
Title: | Microstructures, mechanical properties and strengthening mechanisms of cast Cu–Al alloys processed by cryorolling |
Authors: | Dasharath S.M. Mula, Suhrit Rattan S. Jain V.K. Verma A. |
Published in: | Proceedings of Springer in Physics |
Abstract: | In the present work, the cast structures of Cu-4.5wt% Al alloy was homogenized by annealing at 800 °C for 4 h. The samples were kept under LN2before and during the rolling process in each pass to maintain a constant LN2temperature. Mechanical properties were evaluated by the tensile test. Microstructural analysis was carried by optical microscopy and TEM analysis. The maximum yield strength (YS) of the 75 % cryorolled samples of Cu-4.5wt% Al alloy was found to be 786 MPa with a ductility of 4.8 %. This is due to the formation of ultrafine grains and nano-twins possibly play the pivotal role for the improved YS and ductility. © Springer International Publishing Switzerland 2017. |
Citation: | Proceedings of Springer in Physics, (2017), 479- 482 |
URI: | https://doi.org/10.1007/978-3-319-29096-6_62 http://repository.iitr.ac.in/handle/123456789/18188 |
Issue Date: | 2017 |
Publisher: | Springer Science and Business Media, LLC |
Keywords: | Ductility Mechanical properties Rolling Tensile testing Al-alloy Cast structures Cryo-rolling Microstructural analysis Rolling process Strengthening mechanisms TEM analysis Ultra fine grain Aluminum |
ISBN: | 9.78E+12 |
ISSN: | 9308989 |
Author Scopus IDs: | 56491328100 12783902100 |
Author Affiliations: | Dasharath, S.M., Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Roorkee, Roorkee, Uttarakhand 247667, India Mula, S., Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Roorkee, Roorkee, Uttarakhand 247667, India |
Corresponding Author: | Dasharath, S.M.; Department of Metallurgical and Materials Engineering, Indian Institute of Technology, RoorkeeIndia; email: dashmech@gmail.com |
Appears in Collections: | Conference Publications [MT] |
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