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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/18188
Title: Microstructures, mechanical properties and strengthening mechanisms of cast Cu–Al alloys processed by cryorolling
Authors: Dasharath S.M.
Mula, Suhrit
Rattan S.
Jain V.K.
Verma A.
Published in: Proceedings of Springer in Physics
Abstract: In the present work, the cast structures of Cu-4.5wt% Al alloy was homogenized by annealing at 800 °C for 4 h. The samples were kept under LN2before and during the rolling process in each pass to maintain a constant LN2temperature. Mechanical properties were evaluated by the tensile test. Microstructural analysis was carried by optical microscopy and TEM analysis. The maximum yield strength (YS) of the 75 % cryorolled samples of Cu-4.5wt% Al alloy was found to be 786 MPa with a ductility of 4.8 %. This is due to the formation of ultrafine grains and nano-twins possibly play the pivotal role for the improved YS and ductility. © Springer International Publishing Switzerland 2017.
Citation: Proceedings of Springer in Physics, (2017), 479- 482
URI: https://doi.org/10.1007/978-3-319-29096-6_62
http://repository.iitr.ac.in/handle/123456789/18188
Issue Date: 2017
Publisher: Springer Science and Business Media, LLC
Keywords: Ductility
Mechanical properties
Rolling
Tensile testing
Al-alloy
Cast structures
Cryo-rolling
Microstructural analysis
Rolling process
Strengthening mechanisms
TEM analysis
Ultra fine grain
Aluminum
ISBN: 9.78E+12
ISSN: 9308989
Author Scopus IDs: 56491328100
12783902100
Author Affiliations: Dasharath, S.M., Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Roorkee, Roorkee, Uttarakhand 247667, India
Mula, S., Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Roorkee, Roorkee, Uttarakhand 247667, India
Corresponding Author: Dasharath, S.M.; Department of Metallurgical and Materials Engineering, Indian Institute of Technology, RoorkeeIndia; email: dashmech@gmail.com
Appears in Collections:Conference Publications [MT]

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