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Title: MOdeling and simulation of 3-d interfacial cracks by XFEM
Authors: Pathak H.
Singh A.
Singh, Indra Vir
Zafar S.
Published in: Proceedings of ASME International Mechanical Engineering Congress and Exposition,(IMECE)
Abstract: The structural integrity of multi-layered material depends on the mechanical properties and the fracture behaviour at the interface. The sudden jump in mechanical properties across the interface is the major source of failure in layered materials. An accurate evaluation of mixed-mode SIFs becomes essential for safe design of layered structure components. In this work, extended finite element method (XFEM) has been used to analyze interfacial cracked three-dimensional structures under mechanical loading. In XFEM, partition of unity enrichment concept is used to model a crack e.g. a crack surface is modeled by Heaviside enrichment function whereas a crack front is modeled by branch enrichment functions. Discontinuity due the presence of bi-material interface is modeled by the signed distance function. Modified domain based interaction integral approach has been used to evaluate the individual stress intensity factors. Three-dimensional cylindrical domain having an interfacial crack is taken for the simulations. A comparative analysis has been performed with and without an interface for an embedded penny shape crack. The effect of material interface on the SIFs has been analyzed in detail. Finally, a three-dimensional interfacial crack growth simulation has been performed for arbitrary shape crack. Copyright © 2017 ASME.
Citation: Proceedings of ASME International Mechanical Engineering Congress and Exposition,(IMECE), (2017)
Issue Date: 2017
Publisher: American Society of Mechanical Engineers (ASME)
Keywords: Crack propagation
Finite element method
Fracture mechanics
Function evaluation
Interfaces (materials)
Mechanical properties
Stress intensity factors
Structural health monitoring
Bi-material interfaces
Extended finite element method
Interaction integrals
Interfacial crack growth
Model and simulation
Multilayered materials
Signed distance function
Three-dimensional structure
Nondestructive examination
ISBN: 9.78E+12
Author Scopus IDs: 52364567800
Author Affiliations: Pathak, H., School of Engineering, Indian Institute of Technology, Mandi, Himachal Pradesh, India
Singh, A., Department of Mechanical Engineering, Indian Institute of Technology, Patna, Bihar, India
Singh, I.V., Department of Mechanical and Industrial Engineering, Indian Institute of Technology, Roorkee, Uttarakhand, India
Zafar, S., School of Engineering, Indian Institute of Technology, Mandi, Himachal Pradesh, India
Funding Details: The authors wish to thank the Department of Science and Technology (DST), New Delhi, India for funding this research through grant file no. YSS/2015/001385.
Appears in Collections:Conference Publications [ME]

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