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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/17797
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dc.contributor.authorShedbale A.S.-
dc.contributor.authorSingh I.V.-
dc.contributor.authorMishra, B. K.-
dc.date.accessioned2020-12-03T03:14:20Z-
dc.date.available2020-12-03T03:14:20Z-
dc.date.issued2013-
dc.identifier.citationProceedings of Procedia Engineering, (2013), 642- 651. Chennai-
dc.identifier.issn18777058-
dc.identifier.urihttps://doi.org/10.1016/j.proeng.2013.09.139-
dc.identifier.urihttp://repository.iitr.ac.in/handle/123456789/17797-
dc.description.abstractIn this work, nonlinear analysis of an embedded cracked plate is performed by XFEM in presence of multiple discontinuities under plane stress condition. Von-Mises yield criterion is used to model the elasto-plastic behavior of the plate assuming isotropic strain hardening. The stress-strain response of the plate is modeled using Ramberg-Osgood material model. XFEM is used as a numerical tool to simulate the plate containing a major centre crack, holes and inclusions. A domain based J-integral approach is used to evaluate the stress intensity factors. The generalized Paris law is used to estimate the fatigue life of the plate under mode-I cyclic loading condition. The effect of inclusions and holes on the fatigue life of the component for linear and nonlinear material behavior is discussed in detail. © 2013 The Authors. Published by Elsevier Ltd.-
dc.language.isoen_US-
dc.publisherElsevier Ltd-
dc.relation.ispartofProceedings of Procedia Engineering-
dc.subjectFatigue life-
dc.subjectMultiple discontinuities-
dc.subjectSIF-
dc.subjectVon-Mises yield criterion-
dc.subjectXFEM-
dc.titleNonlinear simulation of an embedded crack in the presence of holes and inclusions by XFEM-
dc.typeConference Paper-
dc.scopusid55881470600-
dc.scopusid55496646600-
dc.scopusid55578538300-
dc.affiliationShedbale, A.S., Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, UK, India-
dc.affiliationSingh, I.V., Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, UK, India-
dc.affiliationMishra, B.K., Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, UK, India-
dc.description.correspondingauthorSingh, I.V.; Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, UK, India; email: ivsingh@gmail.com-
dc.identifier.conferencedetails2013 International Conference on Design and Manufacturing, IConDM 2013, Chennai, 18-20 July 2013-
Appears in Collections:Conference Publications [ME]

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