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dc.contributor.authorDuksh Y.S.-
dc.contributor.authorKumar Kaushik, Brajesh-
dc.contributor.authorSarkar S.-
dc.contributor.authorSingh R.-
dc.date.accessioned2020-12-02T14:15:48Z-
dc.date.available2020-12-02T14:15:48Z-
dc.date.issued2011-
dc.identifier.citationProceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011, (2011). Mesra-
dc.identifier.isbn9.78E+12-
dc.identifier.urihttps://doi.org/10.1109/ICDECOM.2011.5738559-
dc.identifier.urihttp://repository.iitr.ac.in/handle/123456789/16203-
dc.description.abstractThis paper analyzes the effect of driver size and number of shells on propagation delay for Multi-Walled Carbon Nanotubes (MWCNT) interconnect at 22nm technology node. An equivalent circuit model of MWCNT is used for estimation and analysis of propagation delay. The delay through MWCNT and Cu interconnects are compared for various driver sizes and number of MWCNT shells. The SPICE simulation results show that the MWCNT interconnect has lower propagation delay than Cu interconnects. The delay ratio of MWCNT to Cu decreases with increase in length for different driver size and number of MWCNT shells. However, the delay ratio increases with reduction in number of MWCNT shells. MWCNT is considered to be potential alternative to copper interconnects in future. MWCNT provides significant improvement in propagation delay performance over Copper for long (global) interconnects. © 2011 IEEE.-
dc.language.isoen_US-
dc.relation.ispartofProceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011-
dc.subjectCopper-
dc.subjectInterconnects-
dc.subjectMulti-Walled Carbon Nanotube-
dc.subjectPropagation delay-
dc.subjectSPICE-
dc.titleEffect of driver size and number of shells on propagation delay in MWCNT interconnects-
dc.typeConference Paper-
dc.scopusid36805538500-
dc.scopusid57021830600-
dc.scopusid7403239706-
dc.scopusid54913203500-
dc.affiliationDuksh, Y.S., Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India-
dc.affiliationKaushik, B.K., Department of Electronics and Computer Engineering, Indian Institute of Technology, Roorkee, India-
dc.affiliationSarkar, S., School of Electronics Engineering, Shobhit University, Meerut, India-
dc.affiliationSingh, R., School of Electronics Engineering, Shobhit University, Meerut, India-
dc.description.correspondingauthorDuksh, Y.S.; Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India; email: yograj.siet@gmail.com-
dc.identifier.conferencedetails2011 International Conference on Devices and Communications, ICDeCom 2011, Mesra, 24-25 February 2011-
Appears in Collections:Conference Publications [ECE]

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