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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/16203
Title: Effect of driver size and number of shells on propagation delay in MWCNT interconnects
Authors: Duksh Y.S.
Kumar Kaushik, Brajesh
Sarkar S.
Singh R.
Published in: Proceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011
Abstract: This paper analyzes the effect of driver size and number of shells on propagation delay for Multi-Walled Carbon Nanotubes (MWCNT) interconnect at 22nm technology node. An equivalent circuit model of MWCNT is used for estimation and analysis of propagation delay. The delay through MWCNT and Cu interconnects are compared for various driver sizes and number of MWCNT shells. The SPICE simulation results show that the MWCNT interconnect has lower propagation delay than Cu interconnects. The delay ratio of MWCNT to Cu decreases with increase in length for different driver size and number of MWCNT shells. However, the delay ratio increases with reduction in number of MWCNT shells. MWCNT is considered to be potential alternative to copper interconnects in future. MWCNT provides significant improvement in propagation delay performance over Copper for long (global) interconnects. © 2011 IEEE.
Citation: Proceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011, (2011). Mesra
URI: https://doi.org/10.1109/ICDECOM.2011.5738559
http://repository.iitr.ac.in/handle/123456789/16203
Issue Date: 2011
Keywords: Copper
Interconnects
Multi-Walled Carbon Nanotube
Propagation delay
SPICE
ISBN: 9.78E+12
Author Scopus IDs: 36805538500
57021830600
7403239706
54913203500
Author Affiliations: Duksh, Y.S., Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India
Kaushik, B.K., Department of Electronics and Computer Engineering, Indian Institute of Technology, Roorkee, India
Sarkar, S., School of Electronics Engineering, Shobhit University, Meerut, India
Singh, R., School of Electronics Engineering, Shobhit University, Meerut, India
Corresponding Author: Duksh, Y.S.; Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India; email: yograj.siet@gmail.com
Appears in Collections:Conference Publications [ECE]

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