http://repository.iitr.ac.in/handle/123456789/16203
Title: | Effect of driver size and number of shells on propagation delay in MWCNT interconnects |
Authors: | Duksh Y.S. Kumar Kaushik, Brajesh Sarkar S. Singh R. |
Published in: | Proceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011 |
Abstract: | This paper analyzes the effect of driver size and number of shells on propagation delay for Multi-Walled Carbon Nanotubes (MWCNT) interconnect at 22nm technology node. An equivalent circuit model of MWCNT is used for estimation and analysis of propagation delay. The delay through MWCNT and Cu interconnects are compared for various driver sizes and number of MWCNT shells. The SPICE simulation results show that the MWCNT interconnect has lower propagation delay than Cu interconnects. The delay ratio of MWCNT to Cu decreases with increase in length for different driver size and number of MWCNT shells. However, the delay ratio increases with reduction in number of MWCNT shells. MWCNT is considered to be potential alternative to copper interconnects in future. MWCNT provides significant improvement in propagation delay performance over Copper for long (global) interconnects. © 2011 IEEE. |
Citation: | Proceedings of 2011 International Conference on Devices and Communications, ICDeCom 2011, (2011). Mesra |
URI: | https://doi.org/10.1109/ICDECOM.2011.5738559 http://repository.iitr.ac.in/handle/123456789/16203 |
Issue Date: | 2011 |
Keywords: | Copper Interconnects Multi-Walled Carbon Nanotube Propagation delay SPICE |
ISBN: | 9.78E+12 |
Author Scopus IDs: | 36805538500 57021830600 7403239706 54913203500 |
Author Affiliations: | Duksh, Y.S., Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India Kaushik, B.K., Department of Electronics and Computer Engineering, Indian Institute of Technology, Roorkee, India Sarkar, S., School of Electronics Engineering, Shobhit University, Meerut, India Singh, R., School of Electronics Engineering, Shobhit University, Meerut, India |
Corresponding Author: | Duksh, Y.S.; Deptt. of Electronics and Instrumentation Engg., Faculty of Engg. and Tech., M.J.P. Rohilkhand University, Bareilly, India; email: yograj.siet@gmail.com |
Appears in Collections: | Conference Publications [ECE] |
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