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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/14945
Title: A relook at NEH-4 curve number data and antecedent moisture condition criteria
Authors: Mishra, Surendra Kumar
Singh V.P.
Published in: Hydrological Processes
Abstract: This paper investigates the variation of the popular curve number (CN) values given in the National Engineering Hand Book-Section 4 (NEH-4) of the Soil Conservation Service (SCS) with antecedent moisture condition (AMC) and soil type. Using the volumetric concept, involving soil, water, and air, a significant condensation of the NEH-4 tables is achieved. This leads to a procedure for determination of CN for gauged as well as ungauged watersheds. The rainfall-runoff events derived from daily data of four Indian watersheds exhibited a power relation between the potential maximum retention or CN and the 5-day antecedent rainfall amount. Including this power relation, the SCS-CN method was modified. This modification also eliminates the problem of sudden jumps from one AMC level to the other. The runoff values predicted using the modified method and the existing method utilizing the NEH-4 AMC criteria yielded similar results. Copyright © 2006 John Wiley & Sons, Ltd.
Citation: Hydrological Processes (2006), 20(13): 2755-2768
URI: https://doi.org/10.1002/hyp.6066
http://repository.iitr.ac.in/handle/123456789/14945
Issue Date: 2006
Keywords: Antecedent moisture condition
Antecedent rainfall
Curve number
SCS-CN method
Soil Conservation Service
Ungauged watershed
ISSN: 8856087
Author Scopus IDs: 55463271000
57211219633
Author Affiliations: Mishra, S.K., Department of Water Resources Development and Management, Indian Institute of Technology, Roorkee 247667 UP, India
Singh, V.P., Department of Civil and Environmental Engineering, Louisiana State University, Baton Rouge, LA 70803-6405, United States
Corresponding Author: Mishra, S.K.; Indian Institute of Technology, Department of Water Resources Development and Management, Roorkee 247667 UP, India; email: skm61fwt@iitr.ernet.in
Appears in Collections:Journal Publications [WR]

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