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Please use this identifier to cite or link to this item: http://repository.iitr.ac.in/handle/123456789/13126
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dc.contributor.authorLahiri, Indranil-
dc.contributor.authorBhargava S.-
dc.date.accessioned2020-10-15T12:28:58Z-
dc.date.available2020-10-15T12:28:58Z-
dc.date.issued2009-
dc.identifier.citationMaterials Science and Technology (2009), 25(4): 520-526-
dc.identifier.issn2670836-
dc.identifier.urihttps://doi.org/10.1179/174328408X307409-
dc.identifier.urihttp://repository.iitr.ac.in/handle/123456789/13126-
dc.description.abstractFour different compositions of Cu-Cr system (Cu 0·90Cr0·10, Cu0 ·75Cr0·25, Cu0 ·60Cr0·40 and Cu 0·50Cr0·50) were mechanically alloyed using different milling parameters. Samples collected from the milled powder of 24 batches after different time intervals were studied by X-ray diffraction. The diffraction data were analysed by three different line profile analysis methods, namely, Williamson-Hall method, integral breadth method and peak fitting method to calculate the crystallite size and microstrain in the materials. Peak fitting and integral breadth methods were found to be more suitable for the systems under study. Logarithmic relationships between the milling time and crystallite size or microstrain are proposed. The model was further validated by time interpolated data from two of the present batches and two composition extrapolated batches (Cu0·25Cr0·75 and Cu0·10Cr0·90). © 2009 Institute of Materials, Minerals and Mining.-
dc.language.isoen_US-
dc.relation.ispartofMaterials Science and Technology-
dc.subjectCu-Cr-
dc.subjectDomain size-
dc.subjectLine profile analysis-
dc.subjectMechanical alloying-
dc.subjectMicrostrain-
dc.subjectX-ray diffraction-
dc.titleX-ray powder diffraction line profile analysis of mechanically alloyed Cu-Cr powder-
dc.typeArticle-
dc.scopusid7004250718-
dc.scopusid56854829000-
dc.affiliationLahiri, I., Department of Mechanical and Materials Engineering, EC 2760, Florida International University, 10555 West Flagler Street, Miami, FL 33174, United States-
dc.affiliationBhargava, S., Indian Institute of Information Technology Design and Manufacturing, Gokalpur, Jabalpur, MP, India-
dc.description.correspondingauthorLahiri, I.; Department of Mechanical and Materials Engineering, EC 2760, Florida International University, 10555 West Flagler Street, Miami, FL 33174, United States; email: indranil78@yahoo.com-
Appears in Collections:Journal Publications [MT]

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