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Title: Measurement of boiling liquid levels by decomposition of sound waves in a waveguide
Authors: Singh S.
Mohanty A.R.
Published in: Applied Acoustics
Abstract: Many industrial processes require knowledge of the level of hot bubbling liquid in a closed vessel. However, usually conventional instrumentation is unsuitable because of extremely high temperatures, and hot poisonous gases generated by the thermo-chemical processes of the boiling liquid. This paper proposes a novel method to detect such boiling liquid levels by monitoring the boiling/bubbling noise in the vessel using a waveguide. The principle of this method is that the axial modes of the air column and the liquid column in the closed vessel would change with change in liquid height. The sound pressure waves produced in the vessel due to bubbling and propagating along the vessel's axial direction can be captured by decomposition using two microphones in a waveguide co-axially attached to the vessel. These decomposed waves would show peaks at resonance frequencies corresponding to the vessel's axial modes, which would be used to calculate the liquid height. The proposed method was verified through extensive finite element simulations and experiments of boiling water over a wide range of conditions. The boiling water levels were correctly measured in each condition with an average accuracy of 98.8%. Thus, this waveguide system can continuously monitor boiling liquid levels based on the incident wave frequency and amplitude. Such a system has wide industrial applications, particularly in steel plants, where knowing the amount of molten steel during oxygen lancing faces many challenges. © 2017
Citation: Applied Acoustics (2018), 129(): 248-257
Issue Date: 2018
Publisher: Elsevier Ltd
Keywords: Boiling
ISSN: 0003682X
Author Scopus IDs: 56215217100
Author Affiliations: Singh, S., Department of Mechanical Engineering, IIT Kharagpur, Kharagpur, 721302, India
Mohanty, A.R., Department of Mechanical Engineering, IIT Kharagpur, Kharagpur, 721302, India
Corresponding Author: Singh, S.; Indian Institute of Technology KharagpurIndia; email:
Appears in Collections:Journal Publications [ME]

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