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Title: Effect of silicon powder mixed EDM on machining rate of AISI D2 die steel
Authors: Kansal H.K.
Singh S.
Kumar, Pradeep
Published in: Journal of Manufacturing Processes
Abstract: In this paper, the effect of silicon powder mixing into the dielectric fluid of EDM on machining characteristics of AISI D2 (a variant of high carbon high chrome) die steel has been studied. Six process parameters, namely peak current, pulse-on time, pulse-off time, concentration of powder, gain, and nozzle flushing have been considered. The process performance is measured in terms of machining rate (MR). The research outcome will identify the important parameters and their effect on MR of AISI D2 in the presence of suspended silicon powder in a kerosene dielectric of EDM. The study indicated that all the selected parameters except nozzle flushing have a significant effect on the mean and variation in MR (S/N ratio). Optimization to maximize MR has also been undertaken using the Taguchi method. The ANOVA analysis indicates that the percentage contribution of peak current and powder concentration toward MR is maximum among all the parameters. The confirmation runs showed that the setting of peak current at a high level (16 A), pulse-on time at a medium level (100 μs), pulse-off time at a low level (15 μs), powder concentration at a high level (4 g/l), and gain at a low level (0.83 mm/s) produced optimum MR from AISI D2 surfaces when machined by silicon powder mixed EDM.
Citation: Journal of Manufacturing Processes (2007), 9(1): 13-22
Issue Date: 2007
Publisher: Elsevier BV
Keywords: EDM
Machining rate
Silicon powder
Taguchi method
ISSN: 15266125
Author Scopus IDs: 55765000585
Author Affiliations: Kansal, H.K., Dept. of Mechanical Engineering, SLIET, Longowal, India
Singh, S., Dept. of Mechanical and Production Engineering, GND Engineering College, Ludhiana, India
Kumar, P., Dept. of Mechanical and Industrial Engineering, IIT Roorkee, 247672, India
Corresponding Author: Kansal, H.K.; Dept. of Mechanical Engineering, SLIET, Longowal, India; email:
Appears in Collections:Journal Publications [ME]

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