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Browsing by Author Paul N.

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Showing results 1 to 3 of 3
Issue DateTitleAuthor(s)
2018Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applicationsPanigrahi A.K.; Kumar C.H.; Bonam S.; Brince P.K.; Ghosh T.; Paul N.; Vanjari S.R.K.; Singh S.G.
2017Moving object detection using modified temporal differencing and local fuzzy thresholdingPaul N.; Singh A.; Midya A.; Pratim Roy, Partha; Dogra D.P.
2018Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling ApplicationKumar C.H.; Pnaigrahi A.K.; Paul N.; Bonam S.; Krishna Vanjari S.R.; Singh S.G.; Panigrahi A.K.